Conference Announcements

Sim-AM 2019

Second International Conference on Simulation for Additive Manufacturing

Wed, 11 Sep 2019 – Fri, 13 Sep 2019

The Second International Conference on Simulation for Additive Manufacturing (Sim-AM 2019) will be organized in Pavia, Italy, on 11-13 September 2019. The first edition of this conference was held in Munich, Germany in 2017 and attracted more than 170 participants.

Objectives

Additive manufacturing (AM) is evolving as one of the most promising manufacturing technologies for creating solid structures of virtually any shape. Furthermore, AM allows to produce more complex shapes than those obtained through classical manufacturing techniques. As a consequence, applications for AM products range across many fields in engineering, from design models to lightweight components for automotive or aerospace industry, from patient-specific medical implants to civil engineering structural and/or architectural components

 

All these aspects clearly raise new questions for numerical simulations, computational models and design optimizations of the involved products and processes. While products obtained by innovative design approaches through a real shape and/or topology optimization have the potential to revolutionize the market their design itself is much more complicated than for classic manufacturing techniques. Additionally, AM Processes involve multi-physics and multi-scale phenomena. Whereas relevant spatial scales range over many orders of magnitude, important time scales start at microseconds for physical processes and reach to hours or even days. The involved physics often include mechanical, thermal, and phase change problems.

 

Finally, validation and verification are clearly essential steps to accelerate the transformation of AM into an integrated design to manufacturing tool.

 

Main Topics

CAD to part chain

Innovative application

Material modeling

Multi-physics and multi-scale simulation

Shape and topology optimization

Simulation for different AM technologies (fused deposition, laser based methods, …)

Validation and verification


European Community on Computational Methods in Applied Sciences (ECCOMAS)
SIM-AM_Sec@cimne.upc.edu; eccomas@cimne.upc.edu
Conference Website: http://congress.cimne.com/sim-am2019/frontal/default.asp
University of Pavia

Corso Str. Nuova, 65, 27100
Pavia , Pavia
Italy

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